Apple is often first to the starting line when it comes to shrinking silicon, and its partnership with TSMC is one of the main reasons for that lead. As we move into the 2nm era, the roadmap for the next steps is already coming into focus. A new report shows that TSMC is eyeing the sub-1nm milestone and is targeting test production as early as 2029.
TSMC’s silicon roadmap leads to sub-1nm chips
According to DigiTimes, the move to sub-1nm technology will not be a single leap. After the successful start of 2nm mass production at the end of last year, TSMC is already looking ahead to the next milestone. The foundry plans to move to the 1.4nm node in 2028, which is expected to offer 15 percent improved performance and 30 percent better power efficiency.
Next comes the sub-1nm process, with TSMC already preparing its Tainan A10 facility and its P1-P4 facilities for this transition. According to reports, the company has initially set a target of producing 5,000 wafers per month for the 2029 test phase. For Apple, this means the potential for chips with unmatched transistor density to power iPhones and Macs of the early 2030s.
Why this is important
The push toward sub-1nm technology is less about marketing and more about meeting the demands of next-gen computing. As on-device software and AI become more resource-intensive, these nodes will be essential to meet growing performance demands without sacrificing battery life.
However, sub-1nm chips could pose their own challenges. With yield a constant challenge even for TSMC’s 2nm process and manufacturing costs expected to remain high, these cutting-edge SoCs will likely remain the preserve of ultra-tier flagships for the foreseeable future. And while chips may get smaller, prices for top-end devices will likely continue to trend in the opposite direction.
